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SQ3000 CMM FOR AOI

Inspection Application (2D+3D) Geometric coordinates measurement, e.g. CPU socket, Packaging, Solder Bumps, Parts, etc.
Inspection speed (2D+3D): 50cm2/sec to 15 cm2/sec (depends on MRS sensor type)
Minimum features size: 100μm or 70 μm (depends on MRS sensor type)
XY R&R@1σ: <3μm or <2μm (depends on MRS sensor type)
Z R&R@1σ: <2μm
Accuracy XY: 6μm or 5μm (depends on MRS sensor type)
Accuracy Z: 2μm
CATEGORY
Cyberoptics
SUB-CATEGORY
AUTOMATED OPTICAL MEASUREMENT (CMM)

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