Electronic Assembly Line Auxiliary Systems

Inspection Application (2D+3D) Solder paste and SMD glue Inspection speed (2D+3D): 35cm2/sec or 15cm2/sec (depends on MRS sensor type) Minimum component aperture size: 0402mm(01005 in.) or 0201mm (008004 in.) (depends on MRS sensor type) PCB size (Max.): SE3000-DD: Single Lane: 510x510mm; Dual Lane: 350x320mm SE3000-D: Single Lane: 510x510mm; Dual Lane: 510x320mm Measurement Gage R&R <5% or <3%@6σ on Certification Target Height accuracy 3μm on a Certification Target

Inspection Application (2D+3D) Solder paste and SMD glue Inspection speed (2D+3D): Peak: 35cm2/sec & Average: 30 cm2/sec or Peak: 15cm2/sec & Average: 12 cm2/sec (depends on MRS sensor type) Minimum component aperture size: 0402mm(01005 in.) or 0201mm (008004 in.) (depends on MRS sensor type) PCB size: SE3000: 50x50mm – 510x510mm; SE3000-X: 50x120mm – 720x620mm; SE3000-XL: 50x120mm – 1200x610mm (with 2 index inspection capability) Measurement Gage R&R <5% or <3%@6σ on Certification Target Height accuracy 3μm on a Certification Target

Inspection Application (2D+3D) Solder paste and SMD glue Inspection speed (2D+3D): SE500 Ultra: 210cm2/sec @30um; 80cm2/sec @15um SE500-X: Peak: 108cm2/sec & Average: 80 cm2/sec@30um; Peak: 65cm2/sec & Average: 50 cm2/sec@15um PCB size: SE500 Ultra: 50x50mm – 510x510mm; SE500-X: 100x100mm – 810x610mm Measurement Gage R&R SE500 Ultra: <<10% @6σ on Certification Target; SE500-X: <2%@6σ on Certification Target Height accuracy 2μm on a Certification Target

Inspection Application (2D+3D) Solder paste and SMD glue Inspection speed (2D+3D): Peak: 108cm2/sec & Average: 80 cm2/sec@30um; Peak: 56cm2/sec & Average: 30 cm2/sec@15um PCB size: SE600: 50x50mm – 510x510mm; SE600-X: 100x100mm – 710x610mm Measurement Gage R&R <<2% @6σ on Certification Target Height accuracy 2μm on a Certification Target