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Electronic Assembly Line Auxiliary Systems

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Cyberoptics
MX3000 3D AOI MEMORY MODULE INSPECTION
Inspection Application (2D+3D) Various memory module form factors (RDIMM, SODIMM, VLPDIMM, UDIMM, and others)
Inspection speed (2D+3D): 50cm2/sec
Minimum component size: 0402mm (01005 in.)
Board length: Min. 25mm / Max. 140mm
Board width: Min. 17mm / Max. 35mm
MX600 2D AOI MEMORY MODULE INSPECTION
Inspection Application (2D) Various memory module form factors (RDIMM, SODIMM, VLPDIMM, UDIMM, and others)
Inspection speed (2D): 110cm2/sec
Minimum component size: 0402mm
Board length: Min. 25mm / Max. 170mm
Board width: Min. 17mm / Max. 110mm
Cyberoptics
MX3000 3D AOI MEMORY MODULE INSPECTION
Inspection Application (2D+3D) Various memory module form factors (RDIMM, SODIMM, VLPDIMM, UDIMM, and others) Inspection speed (2D+3D): 50cm2/sec Minimum component size: 0402mm (01005 in.) Board length: Min. 25mm / Max. 140mm Board width: Min. 17mm / Max. 35mm
MX600 2D AOI MEMORY MODULE INSPECTION
Inspection Application (2D) Various memory module form factors (RDIMM, SODIMM, VLPDIMM, UDIMM, and others) Inspection speed (2D): 110cm2/sec Minimum component size: 0402mm Board length: Min. 25mm / Max. 170mm Board width: Min. 17mm / Max. 110mm

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