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Electronic Assembly Line Systems

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BTU
Substrate Flatness Reflow Oven
Atmosphere: Air or Nitrogen
Substrate Thickness: ≤ 0.3mm
Carrier Width: ≤ 160mm per lane
BTU
Substrate Flatness Reflow Oven
Atmosphere: Air or Nitrogen Substrate Thickness: ≤ 0.3mm Carrier Width: ≤ 160mm per lane

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