| Inspection Application (2D+3D) | Various memory module form factors (RDIMM, SODIMM, VLPDIMM, UDIMM, and others) | 
| Inspection speed (2D+3D): | 50cm2/sec | 
| Minimum component size: | 0402mm (01005 in.) | 
| Board length: | Min. 25mm / Max. 140mm | 
| Board width: | Min. 17mm / Max. 35mm | 
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